Kunezindlela ezimbili eziyinhloko zokuhlanganisa ngokuthengisa - ukugeleza kabusha kanye ne-wave soldering.
I-Wave soldering ifaka i-solder edlulayo ebhodini elishiswe ngaphambilini.Izinga lokushisa lebhodi, amaphrofayli okushisa nawokupholisa (okungewona alayini), izinga lokushisa le-soldering, i-waveform (iyunifomu), isikhathi se-solder, izinga lokugeleza, isivinini sebhodi, njll. zonke izici ezibalulekile ezithinta imiphumela ye-solder.Zonke izici zomklamo webhodi, ukwakheka, ukuma kwephedi nosayizi, ukuchithwa kokushisa, njll. kudingeka kucatshangelwe ngokucophelela ngemiphumela emihle yokunamathisela.
Kuyacaca ukuthi i-wave soldering iyinqubo enolaka futhi enenkani - pho kungani usebenzise le ndlela nhlobo?
Isetshenziswa ngoba iyindlela engcono kakhulu futhi eshibhe kunazo zonke etholakalayo, futhi kwezinye izimo ukuphela kwendlela esebenzayo.Lapho kusetshenziswa izingxenye zembobo, i-wave soldering ngokuvamile iyindlela yokuzikhethela.
I-Reflow soldering ibhekisela ekusetshenzisweni kwe-solder paste (ingxube ye-solder ne-flux) ukuxhuma ingxenye ye-elekthronikhi eyodwa noma ngaphezulu kumaphedi okuxhumana, kanye nokuncibilikisa i-solder ngokushisa okulawulwayo ukuze kuzuzwe ukubopha unomphela.Amahhavini agelezayo angasetshenziswa, izibani zokushisa ze-infrared noma izibhamu zokushisa nezinye izindlela zokushisa zokushisela.I-Reflow soldering inezidingo ezincane ekubunjweni kwephedi, ukufiphaza, ukuma kwebhodi, iphrofayili yezinga lokushisa (kusabalulekile kakhulu), njll. Ezingxenyeni zokukhweza ngaphezulu, ngokuvamile kuwukukhetha okuhle kakhulu - ingxube ye-solder ne-flux ifakwa ngaphambili yi-stencil noma enye. inqubo ezenzakalelayo, futhi izingxenye zibekwe endaweni futhi ngokuvamile zigcinwe endaweni yi-solder unama.Izinamatheliso zingasetshenziswa ezimweni ezinzima, kodwa azifaneleki ngezingxenye zembobo - ngokuvamile ukugeleza kabusha akuyona indlela yokuzikhethela yezingxenye zembobo.Amabhodi ayinhlanganisela noma anomthamo omkhulu angasebenzisa ingxube yokugeleza kabusha kanye ne-wave soldering, enezingxenye eziholayo kuphela ezibekwe ohlangothini olulodwa lwe-PCB (okuthiwa uhlangothi A), ukuze akwazi ukudayiswa ngamagagasi ohlangothini B. Lapho ingxenye ye-TH kufanele ifakwe ngaphambi kokufakwa kwengxenye yembobo, ingxenye ingaphinda igeleze ngasohlangothini luka-A.Izingxenye ezengeziwe ze-SMD zingase zengezwe ohlangothini lwe-B ukuze zithengiswe ngezingxenye ze-TH.Labo abazimisele ngokufakwa kwe-high wire soldering bangazama izingxube eziyinkimbinkimbi zama-solders ahlukene ancibilika, okuvumela uhlangothi B lugeleze kabusha ngaphambi noma ngemva kokusoda kwegagasi, kodwa lokhu akuvamile kakhulu.
Ubuchwepheshe be-Reflow soldering busetshenziselwa izingxenye ezibekwe phezulu.Nakuba amabhodi amaningi wesifunda se-surface Mount angahlanganiswa ngesandla kusetshenziswa i-soldering iron kanye ne-solder wire, inqubo ihamba kancane futhi ibhodi eliwumphumela lingase lingathembeki.Imishini yesimanje ye-PCB yokuhlanganisa isebenzisa i-reflow soldering ikakhulukazi ukukhiqiza ngobuningi, lapho imishini yokukhetha nendawo ibeka khona izingxenye emabhodini, ambozwe nge-solder paste, futhi yonke inqubo iyazisebenzela.
Isikhathi sokuthumela: Jun-05-2023