I-AOI-SPI
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Umshini wokuhlola we-JUKI 3D we-solder wokuhlola, umshini wokuhlola obonakalayo webhodi le-3D RV-2-3DH(AOI/SPI)
Isivinini esikhulu
Ukuthuthukiswa okukhulu ekuhloleni nge-high-pixel (amaphikseli ayizigidi ezingu-12)
Ukunemba okuphawulekayo
Ukusebenzisa amalensi anokulungiswa okuphezulu kuthuthukisa ukunemba kokuhlolwa kwezingxenye ze-ultra-compact
Ukusebenziseka kalula kokulinganisa
Izindlela zokucubungula okulula ukuzisebenzisa nokudala, kusukela kwabaqalayo ukuya kubantu abadala
Ukuhlola okuzenzakalelayo okuzenzakalelayo
Uchungechunge lwe-RV, olungasetshenziselwa ukukala
Ukuze kuthuthukiswe ukusebenza kahle kwesitshalo sonke
Ukuzuza ukusebenza kahle kwayo yonke imboni ngokuxhumanisa uhlelo
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Umshini wokuhlola unamathisela we-JUKI 3D, umshini wokuhlola obonakalayo webhodi le-3D(AOI/SPI) RV-2-3D
Ukubona ukusheshisa ngeyunithi yakamuva ye-3D.Kuzuzwe isekhondi elingu-0.41/FOV kanye nokuthuthukiswa okungu-34% uma kuqhathaniswa nemodeli yangaphambilini.
Ukuphakama kokulungiswa ngu-0.1 μm, Ukuphindaphinda 10 μm *Ukubona ukuthuthukiswa kokunemba okubalulekile.Ngokuthuthukiswa kobuchwepheshe obusha, thola isithombe se-3D esicacile nesinemba kakhulu.
Ngokungeziwe kusifanekiso sangaphambilini se-2D nemodi yenqubo, kwengezwe imodi yesifanekiso ye-3D entsha.
Ngaphezu kwalokho, ukuthuthukiswa kwe-algorithm entsha yokuhlolwa kwe-fillet.*0402 isiqephu
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I-JUKI 3D solder unama umshini wokuhlola i-RV-2
Sula Isistimu Yokuthwebula Umbono
Ukusebenza okusezingeni eliphezulu komhlaba
Isivinini sokuhlola = 0.2 isekhondi / uhlaka
Ukuhlela okulula
I-CCC (Central Confirmation Control)*
I-SPC ( Ukulawulwa Kwenqubo Yezibalo) *
Isekela ukuhlolwa kwe-3D *