Ijika lezinga lokushisa elivamile le-Sn96.5Ag3.0Cu0.5 ingxubevange ye-reflow-free soldering curve.U-A uyindawo yokushisa, u-B indawo yokushisa engashintshi (indawo yokumanzisa), kanti u-C uyindawo encibilikisa ithini.Ngemuva kuka-260S indawo yokupholisa.
I-Sn96.5Ag3.0Cu0.5 i-alloy ye-curve yezinga lokushisa le-reflow soldering yendabuko engenamthofu
Inhloso yokushisisa indawo A ukushisisa ngokushesha ibhodi le-PCB kuzinga lokushisa lokusebenzisa i-flux.Izinga lokushisa likhuphuka lisuka ekamelweni liye ku-150 ° C cishe imizuzwana engu-45-60, futhi umthambeko kufanele ube phakathi kuka-1 no-3. Uma izinga lokushisa likhuphuka ngokushesha kakhulu, lingase liwe futhi liholele ekushiyekeni okufana nobuhlalu be-solder kanye nebhuloho.
Izinga lokushisa elihlala njalo endaweni B, izinga lokushisa likhuphuka kancane lisuka ku-150°C liye ku-190°C.Isikhathi sisekelwe ezidingweni ezithile zomkhiqizo futhi silawulwa cishe kumasekhondi angu-60 kuya kwangu-120 ukunikeza ukudlala okugcwele kumsebenzi we-solvent flux futhi kukhishwe ama-oxide endaweni yokushisela.Uma isikhathi siside kakhulu, ukusebenza ngokweqile kungase kwenzeke, kuthinte ikhwalithi yokushisela.Kulesi sigaba, i-ejenti esebenzayo ku-solvent ye-flux iqala ukusebenza, futhi i-rosin resin iqala ukuthamba nokugeleza.I-ejenti esebenzayo isakaza futhi ingene nge-rosin resin kuphedi ye-PCB kanye nendawo yokugcina ehlanganisiwe yengxenye, bese ixhumana ne-oxide engaphezulu yephedi kanye nengxenye yendawo yokunamathisela.Ukusabela, ukuhlanza indawo engaphezulu ukuze ishiselwe futhi isuse ukungcola.Ngesikhathi esifanayo, i-rosin resin ikhula ngokushesha ukuze yakhe ifilimu evikelayo oqwembeni olungaphandle lwe-welding surface futhi iyihlukanise nokuxhumana negesi yangaphandle, ivikela i-welding surface kusuka ku-oxidation.Inhloso yokusetha isikhathi esanele sokushisa esingaguquki ukuvumela iphedi ye-PCB kanye nezingxenye ukuthi zifinyelele izinga lokushisa elifanayo ngaphambi kokuthuthwa kabusha kwe-solder nokunciphisa umehluko wezinga lokushisa, ngoba amandla okumunca ukushisa ezingxenye ezihlukene ezifakwe ku-PCB ahluke kakhulu.Vimbela izinkinga zekhwalithi ezibangelwa ukungalingani kwezinga lokushisa ngesikhathi sokugeleza kabusha, njengamatshe amathuna, i-solder yamanga, njll. Uma indawo yokushisa engashintshi ishisa ngokushesha okukhulu, ukugeleza kwe-solder paste kuzokhula ngokushesha futhi kuguquke, kubangele izinkinga ezihlukahlukene zekhwalithi njengezimbotshana, ezishaywayo. ithini, nobuhlalu bethini.Uma isikhathi sokushisa esingaguquki siside kakhulu, i-flux solvent izohwamuka kakhulu futhi ilahlekelwe umsebenzi wayo kanye nomsebenzi wokuvikela ngesikhathi sokuphinda kufakwe i-solder, okuholela ochungechungeni lwemiphumela emibi njengokusoda okubonakalayo, izinsalela ze-solder ezimnyama, namajoyinti abuthuntu e-solder.Ekukhiqizeni kwangempela, isikhathi sokushisa esingaguquki kufanele sibekwe ngokuvumelana nezici zomkhiqizo wangempela kanye ne-lead-free solder paste.
Isikhathi esifanele se-soldering zone C amasekhondi angama-30 kuye kwangama-60.Isikhathi esifushane kakhulu sokuncibilika kukathayela singadala iziphambeko njengokudayiswa okubuthakathaka, kuyilapho isikhathi eside kakhulu singabangela insimbi ye-dielectric eyeqile noma sibe mnyama amalunga e-solder.Kulesi sigaba, i-alloy powder ku-solder paste iyancibilika futhi ihlangane nensimbi endaweni edayisiwe.I-flux solvent ibilisa ngalesi sikhathi futhi isheshisa ukuvuvuka nokungena, futhi inqobe ukungezwani kwendawo emazingeni okushisa aphezulu, ivumele i-solder ye-alloy ye-liquid ukuthi igeleze ne-flux, isakaze ebusweni be-pad futhi isonge indawo yokuphela kwengxenye ukuze yakhe. umphumela wokumanzisa.Ngokwethiyori, lapho izinga lokushisa liphezulu, kuba ngcono umphumela wokumanzisa.Kodwa-ke, ekusebenzeni okusebenzayo, ukubekezelela izinga lokushisa okuphezulu kwebhodi le-PCB nezingxenye kufanele kubhekwe.Ukulungiswa kwezinga lokushisa nesikhathi sendawo yokuphinda kufakwe i-solder iwukufuna ibhalansi phakathi kwezinga lokushisa eliphakeme kanye nomphumela wokudambisa, okungukuthi, ukufeza ikhwalithi ekahle yokudambisa ngaphakathi kwezinga lokushisa eliphakeme elamukelekile nesikhathi.
Ngemuva kwe-welding zone yindawo yokupholisa.Kulesi sigaba, i-solder iyaphola isuka oketshezini iye kokuqinile ukuze yakhe amalunga e-solder, futhi izinhlamvu zekristalu zakheka ngaphakathi kwamalunga e-solder.Ukupholisa okusheshayo kungakhiqiza amalunga athembekile e-solder ane-gloss ekhanyayo.Lokhu kungenxa yokuthi ukupholisa okusheshayo kungenza ilunga le-solder libe yingxubevange enesakhiwo esiqinile, kuyilapho izinga lokupholisa elihamba kancane lizokhiqiza inani elikhulu le-intermetal futhi lenze okusanhlamvu okukhulu endaweni ehlangene.Ukuthembeka kwamandla omshini we-solder enjalo kuphansi, futhi Ingaphezulu le-solder joint lizoba mnyama futhi liphansi ekucwebezeleni.
Isetha izinga lokushisa elingenamthofu le-reflow soldering
Enqubweni ye-reflow soldering ye-lead-free-free soldering, i-cavity yesithando kufanele icutshungulwe kusukela kucezu lonke lweshidi lensimbi.Uma imbobo yesithando somlilo yenziwe ngezingcezu ezincane zeshidi lensimbi, i-warping yesikhala somlilo izokwenzeka kalula ngaphansi kwamazinga okushisa angenawo umthofu.Kudingeka kakhulu ukuhlola ukuhambisana kwethrekhi emazingeni okushisa aphansi.Uma ithrekhi ikhubazekile emazingeni okushisa aphezulu ngenxa yezinto zokwakha kanye nomklamo, ukugxumela nokuwa kwebhodi ngeke kugwemeke.Esikhathini esedlule, i-Sn63Pb37 leaded solder yayiyi-solder evamile.Ama-crystalline alloys anendawo yokuncibilika efanayo kanye nezinga lokushisa lendawo yokuqandisa, kokubili okungu-183°C.Ijoyini ye-lead-free solder ye-SnAgCu ayiyona i-eutectic alloy.Izinga layo lokuncibilika lingama-217°C-221°C.Izinga lokushisa liqinile uma izinga lokushisa lingaphansi kuka-217°C, futhi izinga lokushisa liwuketshezi lapho izinga lokushisa lingaphezu kuka-221°C.Uma izinga lokushisa liphakathi kuka-217°C no-221°C Ingxubevange ibonisa isimo esingazinzile.
Isikhathi sokuthumela: Nov-27-2023