Umkhiqizi we-reflow soldering u-Chengyuan wathola ekukhiqizeni nasekukhiqizeni isikhathi eside ukuthi izizathu eziyinhloko zobuhlalu be-reflow solder zimi kanje:
1. Izinga le-solder lincike kakhulu ku-solder paste
Okuqukethwe kwensimbi ku-solder paste, izinga le-oxidation ye-powder yensimbi, nobukhulu be-metal powder konke kungathinta ukukhiqizwa kwamabhola e-solder.
2. I-mesh yensimbi inethonya elikhulu
a.Ukuvula i-stencil
Amafektri amaningi azovula i-stencil ngokuya ngosayizi wephedi, ukuze kube lula ukuphrinta unamathisele we-solder kungqimba yemaski ye-solder futhi akhiqize ubuhlalu bethini, ngakho-ke kungcono ukuba nokuvulwa kwe-stencil kuncane kunosayizi wangempela. .
b.Ubukhulu bensimbi yensimbi
I-stencil Baidu ivamise ukuba phakathi kuka-0.12~0.17mm, ukujiya kakhulu kuzodala "ukugoqa" kokunamathisela kwe-solder, okuholela ebuhlalu bethini.
3. Ingcindezi yokubeka umshini wokubeka
Ukukhweza ukuthi uma ingcindezi iphezulu kakhulu, ukunamathisela kwe-solder kuzocindezelwa kungqimba lokumelana ne-solder, ngakho-ke ukucindezela okufakwayo akufanele kube kukhulu kakhulu.
Isikhathi sokuthumela: Apr-06-2023