I-Reflow soldering iyindlela yokushisela esetshenziswa kakhulu embonini ye-SMT.Enye indlela yokushisela i-wave soldering.I-Reflow soldering ifanele izingxenye ze-chip, kuyilapho i-wave soldering ifaneleka izingxenye ze-electronic pin.
I-Reflow soldering nayo iyinqubo yokuphinda i-reflow soldering.Umgomo wawo uwukuphrinta noma ukujova inani elifanele lokunamathisela kwe-solder kuphedi ye-PCB bese unamathisela izingxenye ezihambisanayo zokucubungula isichibi se-SMT, bese usebenzisa ukushisisa kwe-convection yomoya oshisayo kwesithando somlilo sokugeleza kabusha ukuncibilikisa unamathisele we-solder, futhi ekugcineni wenze i-solder ethembekile ehlangene. ngokusebenzisa ukupholisa.Xhuma izingxenye nephedi ye-PCB ukuze udlale indima yokuxhuma ngomshini nokuxhuma ugesi.Ngokuvamile, i-reflow soldering ihlukaniswe ngezigaba ezine: ukushisa kwangaphambili, izinga lokushisa elihlala njalo, ukugeleza kabusha nokupholisa.
1. Indawo yokushisa
Indawo yokushisa: yisigaba sokuqala sokushisa somkhiqizo.Inhloso yawo ukushisa ngokushesha umkhiqizo ekamelweni lokushisa futhi usebenzise i-solder paste flux.Ngesikhathi esifanayo, kuyindlela yokushisa edingekayo ukuze ugweme ukulahlekelwa ukushisa okungalungile kwezingxenye ezibangelwa ukushisa okushisayo okusheshayo ngesikhathi sokucwiliswa kwe-tin okulandelayo.Ngakho-ke, umthelela wezinga lokushisa elikhuphukayo emkhiqizweni ubaluleke kakhulu futhi kufanele ulawulwe ngaphakathi kwebanga elifanele.Uma ishesha kakhulu, izokhiqiza ukushaqeka okushisayo, i-PCB kanye nezingxenye zizothinteka ukucindezeleka okushisayo futhi kubangele umonakalo.Ngesikhathi esifanayo, i-solvent ku-solder paste izoshintsha ngokushesha ngenxa yokushisa okusheshayo, okuholela ekuqhumeni nasekubunjweni kobuhlalu be-solder.Uma ihamba kancane kakhulu, i-solder paste solvent ngeke iguquke ngokugcwele futhi ithinte ikhwalithi yokushisela.
2. Indawo yokushisa ehlala njalo
Indawo yokushisa eqhubekayo: inhloso yakhona ukumisa izinga lokushisa kwento ngayinye ku-PCB futhi kufinyelelwe esivumelwaneni ngangokunokwenzeka ukuze kuncishiswe umehluko wezinga lokushisa phakathi kwento ngayinye.Kulesi sigaba, isikhathi sokushisa sengxenye ngayinye side kakhulu, ngoba izingxenye ezincane zizofinyelela ibhalansi kuqala ngenxa yokumuncwa okuncane kokushisa, futhi izingxenye ezinkulu zidinga isikhathi esanele ukuze zibambe izingxenye ezincane ngenxa yokumuncwa okukhulu kokushisa, futhi ziqinisekise ukuthi i-flux ku-solder unamathisele i-volatilized ngokugcwele.Kulesi sigaba, ngaphansi kwesenzo se-flux, i-oxide ku-pad, ibhola le-solder kanye nephinikhodi yengxenye izosuswa.Ngesikhathi esifanayo, i-flux izophinde isuse ibala lamafutha ebusweni bengxenye kanye ne-pad, ikhulise indawo ye-welding futhi ivimbele ingxenye ukuthi iphinde i-oxidized.Ngemuva kwalesi sigaba, zonke izingxenye zizogcina izinga lokushisa elifanayo noma elifanayo, ngaphandle kwalokho ukushisela okungalungile kungase kwenzeke ngenxa yomehluko omkhulu wokushisa.
Izinga lokushisa nesikhathi sokushisa okungaguquki kuncike ebunkingeni bomklamo we-PCB, umehluko wezinhlobo zezingxenye kanye nenani lezingxenye.Ngokuvamile kukhethwa phakathi kuka-120-170 ℃.Uma i-PCB iyinkimbinkimbi ngokukhethekile, izinga lokushisa lendawo yokushisa engaguquki kufanele linqunywe ngezinga lokushisa lokuthambisa i-rosin njengereferensi, ukuze kuncishiswe isikhathi sokushisela sendawo yokugeleza kabusha esigabeni sakamuva.Indawo yokushisa engashintshi yenkampani yethu ngokuvamile ikhethwa ku-160 ℃.
3. Indawo ye-Reflux
Inhloso yendawo yokugeleza kabusha ukwenza i-solder paste incibilike futhi imanzise iphedi ebusweni besici okufanele sishiselwe.
Lapho ibhodi le-PCB lingena endaweni yokugeleza kabusha, izinga lokushisa lizokhuphuka ngokushesha ukwenza ukunamathisela kwe-solder kufinyelele esimweni sokuncibilika.Iphuzu elincibilikayo lokunamathisela kwe-solder eholayo SN: 63 / Pb: 37 yi-183 ℃, kanye ne-lead-free solder paste SN: 96.5/ag: 3 / Cu: 0. Iphoyinti lokuncibilika lika-5 ngu-217 ℃.Kulesi sigaba, i-heater inikeza ukushisa okukhulu kakhulu, futhi izinga lokushisa lomlilo lizobekwa phezulu kakhulu, ukuze izinga lokushisa lokunamathisela i-solder likhuphuke ngokushesha ekushiseni okuphezulu.
Izinga lokushisa eliphakeme lejika le-reflow soldering ngokuvamile linqunywa indawo yokuncibilika ye-solder paste, ibhodi le-PCB kanye nezinga lokushisa elimelana nokushisa lengxenye ngokwayo.Izinga lokushisa eliphakeme lemikhiqizo endaweni yokugeleza kabusha liyahlukahluka kuye ngohlobo lwe-solder paste esetshenzisiwe.Ngokuvamile, izinga lokushisa eliphakeme eliphezulu lokunamathisela kwe-solder elingenamthofu ngokuvamile lingama-230 ~ 250 ℃, kanti lelo lokunamathisela ngomthofu we-solder ngokuvamile lingama-210 ~ 230 ℃.Uma izinga lokushisa eliphakeme liphansi kakhulu, kulula ukukhiqiza i-welding ebandayo kanye nokumanzisa okwanele kwamalunga e-solder;Uma iphezulu kakhulu, i-substrate yohlobo lwe-epoxy resin kanye nezingxenye zepulasitiki zijwayele ukuphekwa, i-PCB igwebu futhi i-delamination, futhi izoholela ekwakhiweni kwezinhlanganisela zensimbi ze-eutectic ngokweqile, okwenza i-solder joint brittle namandla okushisela abe buthaka, okuthinta izakhiwo zemishini zomkhiqizo.
Kufanele kugcizelelwe ukuthi i-flux in the solder paste endaweni yokugeleza kabusha iyasiza ukukhuthaza ukumanzisa phakathi kwe-solder paste kanye nokuphela kwengxenye ye-welding futhi kunciphise ukungezwani okungaphezulu kwe-solder paste ngalesi sikhathi, kodwa ukukhuthazwa kwe-flux kuzokwenza. ivinjwe ngenxa yensalela yomoya-mpilo kanye nama-oxide angaphezulu kwensimbi esithandweni sokugeleza kabusha.
Ngokuvamile, ijika elilungile lokushisa kwesithando somlilo kufanele lihlangabezane nokuthi izinga lokushisa eliphakeme lephoyinti ngalinye ku-PCB kufanele lilingane ngangokunokwenzeka, futhi umehluko akufanele weqe ama-degree angu-10.Kungale ndlela kuphela esingaqinisekisa ukuthi zonke izenzo zokushisela ziqediwe ngokushelela lapho umkhiqizo ungena endaweni yokupholisa.
4. Indawo yokupholisa
Inhloso yendawo yokupholisa ukupholisa ngokushesha izinhlayiya ze-solder ezincibilikisiwe futhi wenze ngokushesha amajoyinti agqamile ane-radian ehamba kancane kanye nenani eligcwele lethini.Ngakho-ke, amafekthri amaningi azolawula indawo yokupholisa kahle, ngoba ivumela ukwakheka kokuhlangana kwe-solder.Ngokuvamile, izinga lokupholisa elishesha kakhulu lizokwenza kuphuze kakhulu ukuthi inhlama ye-solder encibilikisiwe iphole futhi igcine isisila, okuholela ekwenzekeni komsila, ukulola kanye nama-burrs wejoyinti le-solder elibunjiwe.Izinga lokupholisa eliphansi kakhulu lizokwenza isisekelo sendawo ye-PCB pad ihlanganiswe ku-solder unama, okwenza ijoyinti le-solder libe rough, ukushisela okungenalutho kanye nokuhlanganisa okumnyama kwe-solder.Ngaphezu kwalokho, wonke amamagazini ensimbi ekupheleni kwengxenye ye-solder azoncibilika endaweni ehlangene ye-solder, okuholela ekwenqabeni okumanzi noma ekushiseni okungalungile ekugcineni kwe-solder, Kuthinta izinga lokushisela, ngakho izinga lokupholisa elihle libaluleke kakhulu ekubunjweni kwe-solder joint. .Ngokuvamile, umphakeli wokunamathisela we-solder uzoncoma izinga lokupholisa elihlangene le-solder ≥ 3 ℃ / s.
Imboni yaseChengyuan yinkampani egxile ekuhlinzekeni ngemishini yokukhiqiza ye-SMT ne-PCBA.Ikunikeza ikhambi elifaneleka kakhulu.Ineminyaka eminingi yokukhiqiza kanye nesipiliyoni se-R & D.Ochwepheshe abaqeqeshiwe banikeza isiqondiso sokufaka kanye nesevisi yendlu ngendlu ngemva kokuthengisa, ukuze ungabi nazinkathazo ekhaya.
Isikhathi sokuthumela: Apr-09-2022