Inqubo ye-lead-free reflow soldering inqubo inezidingo eziphakeme kakhulu ku-PCB kunenqubo esekelwe kumthofu.Ukumelana nokushisa kwe-PCB kungcono, izinga lokushisa lokushintsha kwengilazi Tg liphezulu, i-coefficient yokwandisa okushisayo iphansi, futhi izindleko ziphansi.
Izidingo zokudayiswa kwe-reflow engenamthofu ze-PCB.
Ku-reflow soldering, i-Tg iyindawo eyingqayizivele yama-polymers, enquma izinga lokushisa elibalulekile lezakhiwo zezinto ezibonakalayo.Ngesikhathi senqubo yokudayiswa kwe-SMT, izinga lokushisa le-solder liphakeme kakhulu kune-Tg ye-PCB substrate, futhi izinga lokushisa elingenamthofu liyi-34 ° C liphakeme kunalelo elinomthofu, okwenza kube lula ukuguqulwa kokushisa kwe-PCB nokulimala. ezingxenyeni ngesikhathi sokupholisa.Izinto eziyisisekelo ze-PCB ezine-Tg ephezulu kufanele zikhethwe kahle.
Ngesikhathi sokushisela, uma izinga lokushisa likhuphuka, i-Z-axis ye-PCB yesakhiwo se-multilayer ayifani ne-CTE phakathi kwezinto ezilayiniwe, i-glass fiber, ne-Cu ekuqondeni kwe-XY, okuzodala ukucindezeleka okukhulu ku-Cu, futhi ezimweni ezimbi kakhulu, kuzokwenza ukuthi ukucwenga komgodi owenziwe ngensimbi kuphuke futhi kubangele ukukhubazeka kokushisela.Ngoba kuncike ezintweni eziningi eziguquguqukayo, njengenombolo yesendlalelo se-PCB, ukujiya, impahla ye-laminate, ijika le-soldering, kanye nokusabalalisa kwe-Cu, ngejiyomethri, njll.
Ekusebenzeni kwethu kwangempela, sithathe izinyathelo ezithile zokunqoba ukuphuka kwembobo eyenziwe ngensimbi yebhodi lezendlalelo eziningi: isibonelo, i-resin/fibre yengilazi ikhishwa ngaphakathi kwembobo ngaphambi kokufakwa kwe-electroplating enqubweni yokufaka i-recess.Ukuqinisa amandla okubopha phakathi kodonga lwembobo enensimbi kanye nebhodi lezingqimba eziningi.Ukujula kwe-etch kungu-13~20µm.
Izinga lokushisa elilinganiselwe le-FR-4 substrate PCB ngu-240°C.Ngemikhiqizo elula, izinga lokushisa eliphakeme lika-235 ~ 240 ° C lingahlangabezana nezidingo, kodwa emikhiqizweni eyinkimbinkimbi, kungase kudinge u-260 ° C ukuze kudayiswe.Ngakho-ke, amapuleti aminyene nemikhiqizo eyinkimbinkimbi idinga ukusebenzisa ukumelana nokushisa okuphezulu kwe-FR-5.Ngenxa yokuthi izindleko ze-FR-5 ziphezulu uma kuqhathaniswa, emikhiqizweni evamile, isisekelo esiyinhlanganisela se-CEMn singasetshenziswa ukufaka esikhundleni sama-substrates e-FR-4.I-CEMn iyinhlanganisela eqinile ye-laminate ye-copper-clad engaphezulu nomgogodla wayo owenziwe ngezinto ezahlukene.I-CEMn ngamafuphi imele amamodeli ahlukene.
Isikhathi sokuthumela: Jul-22-2023