Esikhathini samanje sokukhula okwandayo kwemikhiqizo ye-elekthronikhi, ukuze kuphishekele usayizi omncane kakhulu kanye nokuhlanganiswa okujulile kwama-plug-ins, ama-PCB anezinhlangothi ezimbili athandwa kakhulu, futhi bayanda, abaklami ukuze baklame amancane, ngaphezulu. imikhiqizo ehlangene futhi ephansi.Enqubweni ye-reflow soldering engenawo umthofu, i-reflow soldering enezinhlangothi ezimbili isetshenziswe kancane kancane.
Ukuhlaziywa kwenqubo yokudayiswa kwe-reflow-free soldering ezinhlangothini ezimbili:
Eqinisweni, amabhodi amaningi e-PCB anamacala amabili akhona asathengisa ingxenye yengxenye ngokugeleza kabusha, abese ethengisa uhlangothi lwephini nge-wave soldering.Isimo esinjalo yi-solder yamanje ye-reflow ephindwe kabili, futhi kusenezinkinga ezithile ohlelweni ezingakaxazululwa.Ingxenye engezansi yebhodi elikhulu kulula ukuwa ngesikhathi senqubo yesibili yokugeleza kabusha, noma ingxenye ye-solder ephansi ehlangene iyancibilika ukuze kubangele izinkinga zokuthembeka kwe-solder joint.
Ngakho-ke, kufanele sikufinyelele kanjani ukuphinda kufakwe i-reflow soldering ezinhlangothini ezimbili?Okokuqala ukusebenzisa i-glue ukunamathisela izingxenye kuyo.Uma iphendulwa futhi ingena ku-soldering ye-reflow yesibili, izingxenye zizolungiswa kuyo futhi ngeke ziwe.Le ndlela ilula futhi iyasebenza, kodwa idinga imishini eyengeziwe kanye nokusebenza.Izinyathelo zokuqeda, ngokwemvelo kwandisa izindleko.Okwesibili ukusebenzisa ama-solder alloys anamaphuzu ahlukene okuncibilika.Sebenzisa i-alloy ephezulu yokuncibilika ohlangothini lokuqala kanye ne-alloy yephoyinti elincibilikayo eliphansi ohlangothini lwesibili.Inkinga ngale ndlela ukuthi ukukhethwa kwe-alloy encibilikayo ephansi kungase kuthinteke umkhiqizo wokugcina.Ngenxa yomkhawulo wokushisa okusebenzayo, ama-alloys anephuzu eliphezulu lokuncibilika azokwandisa izinga lokushisa lokugeleza kabusha kwe-solder, okuzodala umonakalo ezingxenyeni kanye ne-PCB ngokwayo.
Ezingxenyeni eziningi, ukungezwani okungaphezulu kwethini elincibilikisiwe ekuhlanganyeleni kwanele ukubamba ingxenye engezansi futhi yakhe i-solder enokwethenjelwa okuphezulu.Izinga lika-30g/in2 livame ukusetshenziswa ekwakhiweni.Indlela yesithathu iwukushaya umoya obandayo engxenyeni engezansi yesithando somlilo, ukuze izinga lokushisa lendawo ye-solder elingaphansi kwe-PCB ligcinwe ngaphansi kwendawo yokuncibilika ekufakweni kwe-reflow yesibili.Ngenxa yokuhluka kwezinga lokushisa phakathi kwezindawo ezingaphezulu neziphansi, ukucindezeleka kwangaphakathi kukhiqizwa, futhi izindlela eziphumelelayo nezinqubo ziyadingeka ukuze kuqedwe ukucindezeleka nokuthuthukisa ukuthembeka.
Isikhathi sokuthumela: Jul-13-2023