I-PCB (Printed Circuit Board) idlala indima ebalulekile empilweni yanamuhla.Iyisisekelo kanye nothelawayeka wezingxenye ze-elekthronikhi.Mayelana nalokhu, ikhwalithi ye-PCB ibalulekile.
Ukuhlola ikhwalithi ye-PCB, ukuhlolwa kokwethembeka okumbalwa kufanele kwenziwe.Izigaba ezilandelayo ziyisingeniso sezivivinyo.
1. Ukuhlolwa kokungcola kwe-Ionic
Inhloso: Ukuhlola inani lama-ion ebusweni bebhodi lesifunda ukuze unqume ukuthi ukuhlanzeka kwebhodi lesifunda kuyafaneleka yini.
Indlela: Sebenzisa i-75% propanol ukuhlanza indawo yesampula.Ama-ion angancibilika abe yi-propanol, eshintsha ukusebenza kwawo.Izinguquko ku-conductivity zirekhodwa ukuze kunqunywe ukugxila kwe-ion.
Okujwayelekile: ngaphansi noma kulingana no-6.45ug.NaCl/sq.in
2. Ukuhlolwa kokumelana kwamakhemikhali kwe-solder mask
Inhloso: Ukuhlola ukumelana kwamakhemikhali kwe-solder mask
Indlela: Engeza i-qs (i-quantum inelisekile) i-dichloromethane dropwise endaweni yesampula.
Ngemva kwesikhashana, sula i-dichloromethane ngekotini elimhlophe.
Hlola ukuze ubone ukuthi ukotini unamabala nokuthi imaski ye-solder iyancibilika yini.
Okujwayelekile: Awukho udayi noma ncibilika.
3. Ukuhlolwa kokuqina kwe-solder mask
Inhloso: Hlola ubulukhuni bemaski ye-solder
Indlela: Beka ibhodi endaweni eyisicaba.
Sebenzisa ipeni lokuhlola elijwayelekile ukunwaya ububanzi bokuqina esikebheni kuze kungabikho imihuzuko.
Qopha ubulukhuni obuphansi bepensela.
Okujwayelekile: Ubulukhuni obuncane kufanele bube phezulu kuno-6H.
4. Ukuhlolwa kwamandla okuhlubula
Inhloso: Ukuhlola amandla angakhumula izintambo zethusi ebhodini lesekethe
Izisetshenziswa: Isihloli Sokuqina Kwe-Peel
Indlela: Hlubula ucingo lwethusi okungenani lube ngu-10mm ohlangothini olulodwa lwe-substrate.
Beka ipuleti eliyisampula kumhloli.
Sebenzisa amandla amile ukuhlubula intambo yethusi esele.
Amandla okurekhoda.
Okujwayelekile: Amandla kufanele eqe u-1.1N/mm.
5. Ukuhlolwa kwe-Solderability
Inhloso: Ukuhlola ukudayiswa kwamaphedi kanye nezimbobo ebhodini.
Izinsiza: umshini wokunamathisela, i-oven kanye ne-timer.
Indlela: Bhaka ibhodi kuhhavini ku-105 ° C ihora elingu-1.
I-Dip flux.Faka ibhodi ngokuqinile emshinini we-solder ku-235 ° C, futhi uyikhiphe ngemva kwemizuzwana engu-3, uhlola indawo yephedi eyayicwiliswe ethini.Beka ibhodi libheke phezulu emshinini wokugcwalisa ongu-235°C, ulikhiphe ngemva kwemizuzwana emi-3, bese uhlola ukuthi imbobo ephumela ethini icwiliswe yini.
Okujwayelekile: Iphesenti yendawo kufanele ibe nkulu kuno-95. Kuzo zonke izimbobo kufanele kucwiliswe ethini.
6. Ukuhlolwa kwe-Hipot
Inhloso: Ukuhlola amandla kagesi ebhodi lesifunda.
Izisetshenziswa: Umhloli we-Hipot
Indlela: Hlanza futhi ome amasampula.
Xhuma ibhodi kumhloli.
Khulisa i-voltage ibe ngu-500V DC (amanje ngqo) ngenani elingekho ngaphezu kuka-100V/s.
Yibambe ku-500V DC imizuzwana engama-30.
Okujwayelekile: Akumele kube namaphutha kusekethe.
7. Ukuhlolwa kwezinga lokushisa lokushintsha kwengilazi
Inhloso: Ukuhlola izinga lokushisa lokushintsha kwengilazi yepuleti.
Izisetshenziswa: DSC (Differential Scanning Calorimeter) umhloli, ihhavini, isomisi, izikali zikagesi.
Indlela: Lungiselela isampula, isisindo salo kufanele sibe ngu-15-25mg.
Amasampula abhakwa kuhhavini ku-105 ° C amahora angu-2, bese epholiswa ekamelweni lokushisa ku-desiccator.
Beka isampula kusiteji sesampula sesihloli se-DSC, bese usetha izinga lokushisa libe ngu-20 °C/min.
Skena kabili bese urekhoda Tg.
Okujwayelekile: Tg kufanele ibe ngaphezu kuka-150°C.
8. Ukuhlolwa kwe-CTE (i-coefficient of thermal expansion).
Ithagethi: CTE yebhodi lokuhlola.
Izisetshenziswa: TMA (ukuhlaziywa kwe-thermomechanical) umhloli, ihhavini, isomisi.
Indlela: Lungiselela isampula ngosayizi we-6.35 * 6.35mm.
Amasampula abhakwa kuhhavini ku-105 ° C amahora angu-2, bese epholiswa ekamelweni lokushisa ku-desiccator.
Beka isampula kusiteji sesampula sesihloli se-TMA, setha izinga lokushisa libe ngu-10°C/min, bese usetha izinga lokushisa lokugcina libe ngu-250°C.
Qopha ama-CTE.
9. Ukuhlolwa kokumelana nokushisa
Inhloso: Ukuhlola ukumelana nokushisa kwebhodi.
Izisetshenziswa: TMA (ukuhlaziywa kwe-thermomechanical) umhloli, ihhavini, isomisi.
Indlela: Lungiselela isampula ngosayizi we-6.35 * 6.35mm.
Amasampula abhakwa kuhhavini ku-105 ° C amahora angu-2, bese epholiswa ekamelweni lokushisa ku-desiccator.
Beka isampula kusiteji sesampula sesihloli se-TMA, bese usetha izinga lokushisa libe ngu-10 °C/min.
Izinga lokushisa eliyisampula linyuselwe ku-260°C.
I-Chengyuan Industry Professional Coating Machine Manufacturer
Isikhathi sokuthumela: Mar-27-2023