(1) Isimiso sei-reflow soldering
Ngenxa ye-miniaturization eqhubekayo yamabhodi e-PCB yomkhiqizo we-elekthronikhi, kuvele izingxenye ze-chip, futhi izindlela zokushisela zendabuko azikwazanga ukuhlangabezana nezidingo.I-Reflow soldering isetshenziswa ekuhlanganisweni kwamabhodi esekethe ahlanganisiwe ayi-hybrid, futhi iningi lezingxenye eziqoqwe futhi ezishiselwe ama-chip capacitor, ama-chip inductors, ama-transistors agibeleli nama-diode.Ngokuthuthuka kwabo bonke ubuchwepheshe be-SMT buya ngokuya buphelela, ukuvela kwezinhlobonhlobo zezingxenye ze-chip (SMC) kanye namadivayisi afakayo (SMD), ubuchwepheshe benqubo yokuphinda kufakwe i-solder kanye nemishini njengengxenye yobuchwepheshe bokukhuphuka nakho kuye kwathuthukiswa ngokufanele. , futhi izicelo zabo ziya ngokuya ziba ziningi.Isetshenziswe cishe kuzo zonke izinkambu zemikhiqizo ye-elekthronikhi.I-Reflow soldering iyi-solder ethambile eqaphela uxhumano lwemishini kanye nogesi phakathi kweziphetho ze-solder zezingxenye ezifakwe phezulu noma izikhonkwane namaphedi ebhodi aphrintiwe ngokuphinda ancibilikise i-solder elayishwe unamathisele esakazwa ngaphambili kumaphedi ebhodi aphrintiwe.weld.I-Reflow soldering iwukuba izingxenye ze-solder ebhodini le-PCB, futhi i-reflow soldering iwukukhweza amadivaysi phezulu.I-Reflow soldering incike esenzweni sokugeleza komoya oshisayo kumajoyinti e-solder, futhi i-jelly-like flux ibhekana nokusabela ngokomzimba ngaphansi kokugeleza komoya othile okushisa okuphezulu ukuze kuzuzwe i-SMD soldering;ngakho-ke kubizwa ngokuthi "i-reflow soldering" ngoba igesi ijikeleza emshinini wokushisela ukuze ikhiqize izinga lokushisa eliphezulu ukuze kuzuzwe inhloso ye-soldering..
(2) Umgomo wei-reflow solderingumshini ihlukaniswe izincazelo eziningana:
A. Uma i-PCB ingena endaweni yokushisisa, i-solvent negesi ekunamathisele kwi-solder kuyahwamuka.Ngesikhathi esifanayo, ukuguquguquka kwe-solder paste kumanzisa amaphedi, izingxenye zetheminali namaphini, futhi i-solder paste iyathambisa, igoqe, futhi imboze unamathisele we-solder.ipuleti ukuze lihlukanise amaphedi kanye nezikhonkwane zengxenye kumoya-mpilo.
B. Uma i-PCB ingena endaweni yokugcina ukushisa, i-PCB kanye nezingxenye zishiswa ngokugcwele ukuze kuvinjelwe i-PCB ukuthi ingangeni ngokuzumayo endaweni yokushisa ephezulu yokushisela nokulimaza i-PCB nezingxenye.
C. Lapho i-PCB ingena endaweni yokushisela, izinga lokushisa likhuphuka ngokushesha ukuze i-solder paste ifinyelele esimweni sokuncibilika, futhi i-solder ewuketshezi imanzisa, ihlakaze, ihlukanise, ihlukanise, noma iphinde igeleze kabusha amaphedi, iziphetho zengxenye nezikhonkwane ze-PCB ukuze zakhe amalunga e-solder. .
D. I-PCB ingena endaweni yokupholisa ukuze iqinise amalunga e-solder;lapho i-reflow soldering isiqediwe.
(3) Izidingo zenqubo yei-reflow solderingumshini
Ubuchwepheshe be-Reflow soldering abujwayelekile emkhakheni wokukhiqiza ngogesi.Izingxenye ezisemabhodini ahlukahlukene asetshenziswa kumakhompuyutha ethu zidayiswa kumabhodi esekethe ngale nqubo.Izinzuzo zale nqubo yukuthi izinga lokushisa lilula ukulawula, i-oxidation ingagwenywa ngesikhathi senqubo ye-solder, futhi izindleko zokukhiqiza kulula ukulawula.Kunesekhethi yokushisisa ngaphakathi kwalesi divayisi, eshisisa igesi ye-nitrogen ifike ezingeni lokushisa eliphezulu ngokwanele futhi iyivuthele ebhodini lesifunda lapho izingxenye zinamathiselwe khona, ukuze i-solder ezinhlangothini zombili zezingxenye incibilike bese iboshelwa ebhodini lomama. .
1. Setha iphrofayili yezinga lokushisa eligeleza kabusha eligcwele futhi wenze ukuhlola kwesikhathi sangempela kwephrofayili yezinga lokushisa njalo.
2. Weld ngokusho isiqondiso Welding of PCB design.
3. Vimbela ngokuqinile ibhande lokuthutha ukuthi lingadlidlizi ngesikhathi senqubo yokushisela.
4. Umphumela wokushisela webhodi eliphrintiwe kufanele uhlolwe.
5. Kungakhathaliseki ukuthi i-welding yanele, kungakhathaliseki ukuthi ubuso be-solder joint bushelelezi, kungakhathaliseki ukuthi ukuma kwe-solder joint kuyi-half-moon, isimo samabhola e-solder nezinsalela, isimo se-welding eqhubekayo kanye ne-welding virtual.Futhi hlola ukushintshwa kombala we-PCB nokunye.Futhi ulungise ijika lokushisa ngokwemiphumela yokuhlola.Ikhwalithi yokushisela kufanele ihlolwe njalo ngesikhathi sokukhiqiza.
(4) Izinto ezithinta inqubo yokugeleza kabusha:
1. Ngokuvamile i-PLCC ne-QFP zinamandla okushisa amakhulu kunezingxenye ze-chip ezihlukene, futhi kunzima kakhulu ukushisela izingxenye zendawo enkulu kunezingxenye ezincane.
2. Kuhhavini lokugeleza kabusha, ibhande lokuthutha liphinde libe uhlelo lokulahla ukushisa lapho imikhiqizo edlulisiwe igeleza kabusha ngokuphindaphindiwe.Ngaphezu kwalokho, izimo zokushisa ukushisa emaphethelweni kanye nendawo ephakathi kwengxenye yokushisa zihlukile, futhi izinga lokushisa emaphethelweni liphansi.Ngaphezu kwezidingo ezihlukene, izinga lokushisa lendawo efanayo yokulayisha nayo ihlukile.
3. Umthelela wokulayishwa kwemikhiqizo ehlukene.Ukulungiswa kwephrofayili yezinga lokushisa kwe-reflow soldering kufanele kucabangele ukuthi ukuphindaphinda okuhle kungatholakala ngaphansi kokungalayishi, ukulayishwa kanye nezici ezihlukene zomthwalo.Isici somthwalo sichazwa ngokuthi: LF=L/(L+S);lapho L=ubude be-substrate ehlanganisiwe kanye no-S=izikhala ze-substrate ehlanganisiwe.Uma kuphakeme isici somthwalo, kuba nzima nakakhulu ukuthola imiphumela ephindaphindekayo yenqubo yokugeleza kabusha.Ngokuvamile isici esiphezulu somthwalo we-ovini yokugeleza kabusha sisebangeni lika-0.5~0.9.Lokhu kuncike esimweni somkhiqizo (ingxenye ye-soldering density, ama-substrates ahlukene) kanye namamodeli ahlukene weziko lokugeleza kabusha.Okuhlangenwe nakho okusebenzayo kubalulekile ukuze uthole imiphumela emihle yokushisela nokuphindaphinda.
(5) Yiziphi izinzuzoi-reflow solderingubuchwepheshe bomshini?
I-1) Lapho i-soldering ngobuchwepheshe be-reflow soldering, asikho isidingo sokucwilisa ibhodi lesifunda eliphrintiwe ku-solder encibilikisiwe, kodwa ukushisa kwendawo kusetshenziselwa ukuqedela umsebenzi we-solder;ngakho-ke, izingxenye ezizothengiswa zingaphansi kokushaqeka okuncane okushisayo futhi ngeke kubangelwa ukulimala kokushisa ngokweqile ezingxenyeni.
I-2) Njengoba ubuchwepheshe be-welding budinga kuphela ukusebenzisa i-solder engxenyeni ye-welding futhi iyishise endaweni ukuze iqedele ukushisela, ukukhubazeka kwe-welding okufana ne-bridging kuyagwenywa.
I-3) Kubuchwepheshe benqubo ye-reflow soldering, i-solder isetshenziswa kanye kuphela, futhi akukho ukusetshenziswa kabusha, ngakho-ke i-solder ihlanzekile futhi ayinakho ukungcola, okuqinisekisa ikhwalithi yamalungu e-solder.
(6) Isingeniso sokugeleza kwenqubo yei-reflow solderingumshini
Inqubo ye-reflow soldering ibhodi lokukhweza elingaphezulu, futhi inqubo yalo iyinkimbinkimbi kakhulu, engahlukaniswa ngezinhlobo ezimbili: ukukhweza okuhlangene kanye nokufakwa kabili.
A, ukukhweza okunohlangothi olulodwa: unamathisela isoda ngaphambili → isiqephu (ihlukaniswe yaba ukukhweza okwenziwa ngesandla kanye nokukhwezwa komshini okuzenzakalelayo) → ukuphinda kufakwe i-solder → ukuhlolwa nokuhlolwa kukagesi.
B, Ukukhweza okunezinhlangothi ezimbili: Kunamathisela isoda ngaphambili ohlangothini A → I-SMT (ihlukaniswe yaba indawo ephathwayo kanye nokubekwa komshini othomathikhi) → Ukunamathisela kabusha → Inamathisela isoda ngaphambili ohlangothini B → I-SMD (ihlukaniswe yaba ukubekwa ngesandla kanye nokubeka umshini ngokuzenzakalelayo ) ukubekwa) → ukusoda kabusha → ukuhlolwa nokuhlolwa kukagesi.
Inqubo elula ye-reflow soldering "i-screen printing solder paste - patch - reflow soldering, umnyombo wawo okunemba kokuphrinta kwesikrini sikasilika, futhi izinga lokuvuzwa linqunywa i-PPM yomshini wokunamathisela i-patch soldering, kanye ne-reflow soldering ukulawula izinga lokushisa nokushisa okuphezulu.kanye nokuncipha kwejika lokushisa.”
(7) Uhlelo lokulungisa umshini wokugcwalisa ugesi
Umsebenzi wokulungisa okufanele siwenze ngemva kokusetshenziswa kwe-reflow soldering;ngaphandle kwalokho, kunzima ukugcina impilo yesevisi yemishini.
1. Zonke izingxenye kufanele zihlolwe nsuku zonke, futhi ukunaka okukhethekile kufanele kukhokhwe ebhandeni lokuthutha, ukuze lingakwazi ukunamathela noma ukuwa.
2 Lapho ulungisa kabusha umshini, ukunikezwa kwamandla kufanele kucishwe ukuvimbela ukushaqeka kukagesi noma ukujikeleza okufushane.
3. Umshini kufanele uzinze futhi ungatsheki noma ungazinzi
4. Endabeni yezindawo zokushisa ezingazodwana eziyeka ukushisisa, qala uhlole ukuthi i-fuse ehambisanayo isatshalaliswe kusengaphambili kuphedi ye-PCB ngokuncibilikisa ukunamathisela.
(8) Izinyathelo zokuqapha umshini wokugcwalisa kabusha wokunamathisela
1. Ukuze kuqinisekiswe ukuphepha komuntu siqu, umqhubi kufanele asuse ilebula kanye nemihlobiso, futhi imikhono akufanele ikhululeke kakhulu.
2 Naka izinga lokushisa eliphezulu ngesikhathi sokusebenza ukuze ugweme ukugcina ukushisa
3. Ungabeki ngokuzenzakalelayo indawo yokushisa nesivinini sei-reflow soldering
4. Qinisekisa ukuthi igumbi lingena umoya, futhi isikhiphi somusi kufanele siholele ngaphandle kwefasitela.
Isikhathi sokuthumela: Sep-07-2022