Izizathu eziyinhloko zokushisisa okungalingani kwezingxenye zenqubo ye-SMT ehola-free reflow soldering yilezi: umthwalo womkhiqizo we-lead-free reflow soldering ongenawo umthofu, ibhande elihambisayo noma ithonya le-heater edge, kanye nomehluko kumthamo wokushisa noma ukumuncwa kokushisa kwezingxenye ze-reflow soldering ezingenawo umthofu.
①Umthelela wamavolumu ahlukene wokulayisha umkhiqizo.Ukulungiswa kwejika lokushisa lokunamathisela okugeleza kabusha okunganomthofu kufanele kucabangele ukuthola ukuphindaphinda okuhle ngaphansi kokungalayishi, ukulayishwa kanye nezici ezihlukene zomthwalo.Isici somthwalo sichazwa ngokuthi: LF=L/(L+S);lapho L=ubude be-substrate ehlanganisiwe kanye no-S=isikhala phakathi kwama-substrate ahlanganisiwe.
②Kuhhavini wokugeleza kabusha ongenamthofu, ibhande lokudlulisa liphinde libe isistimu yokukhipha ukushisa kuyilapho lithutha ngokuphindaphindiwe imikhiqizo yokudayiswa okugeleza kabusha okungenayo umthofu.Ngaphezu kwalokho, izimo zokushisa ukushisa zihlukile emaphethelweni naphakathi nendawo yengxenye yokushisa, futhi izinga lokushisa emaphethelweni ngokuvamile liphansi.Ngaphezu kwezidingo ezihlukene zokushisa zendawo ngayinye yokushisa esithandweni, izinga lokushisa endaweni efanayo yomthwalo nalo lihlukile.
③ Ngokuvamile, i-PLCC ne-QFP zinamandla okushisa amakhulu kunengxenye ye-chip eqondile, futhi kunzima kakhulu ukushisela izingxenye zendawo enkulu kunezingxenye ezincane.
Ukuze uthole imiphumela ephindaphindwayo enqubweni ye-lead-free reflow soldering process, lapho isici somthwalo sikhulu, kuba nzima nakakhulu.Imvamisa umkhawulo ophezulu wesici somthwalo wamahhavini agelezayo angenawo umthofu usukela ku-0.5-0.9.Lokhu kuncike ezimweni zomkhiqizo (ubuningi be-soldering yengxenye, ama-substrates ahlukene) namamodeli ahlukene weziko lokugeleza kabusha.Ukuthola imiphumela emihle yokushisela nokuphindaphinda, isipiliyoni esisebenzayo sibalulekile.
Isikhathi sokuthumela: Nov-21-2023