I-JUKI KE-2070Isidubuli se-chip esivumelana nesivinini esiphezulu Isithombe Esifakiwe

I-JUKI KE-2070High-speed flexible chip shooter

Izici:

（1）*Beka ikhanda le-laser yekhanda le-multi-nozzle (6 imibhobho)

(2)*Izinga lokubeka(ubukhulu) -18,300 cph laser centering (IPC 9850) -4,600 cph umbono omaphakathi ne-MNVC (optical)

(3) * Ububanzi bengxenye-01005 - 33.5 x 33.5mm

(4)*Ubude bengxenye(ubukhulu) -12mm

(5)*Ukunemba kokubekwa-±50μm (Cpk ≥ 1) ukugxilisa i-laser

(6)*Ubukhulu bebhodi(ubukhulu)-800 x 460 mm(ngenketho ende)

Ukubonisana ku-inthanethi Xhumana nathi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

1 Inzwa ye-laser entsha: LNC60

Ikhanda elisha le-laser ye-LNC60 liyakwazi ukukhetha nokubeka maphakathi izingxenye eziyisi-6 ngesikhathi esisodwa.Ingafinyelela isivinini esingafika ku-18,300 CPH (IPC-9850), ukuthuthukiswa okungu-23% kunesizukulwane esedlule.Kungaxhunywa imibhobho ehlukahlukene ngesikhathi esisodwa, kunciphisa isikhathi sokushintsha umbhobho.Nge-MNVC yokuzithandela (i-multi-nozzle vision centering), ukuphuphuma kwamadivayisi anemba okuphezulu kukhuphuka ngo-40%.Futhi zonke lezi zici zitholakala emshinini ohlangene ngokuphawulekayo wokukhiqiza okungenakuqhathaniswa.

I-LNC60 iletha umqondo omusha we-laser centering emakethe.Le nzwa inekhono eliyingqayizivele lokubeka phakathi izingxenye kusuka ku-0402 (01005) kuya kuzingxenye zesikwele ezingu-33.5mm.Kusukela ku-ultra-small, ultra-thin, izingxenye ezimise okwe-chip kuya ku-QFP encane, i-CSP, i-BGA, uhla olubanzi lwezingxenye lungafakwa ngohlelo lokuqaphela i-laser ngesivinini esikhulu nangokunemba okuphezulu.

2 I-Dual XY drive system namakhanda ashayelwa ngokuzimela

Uhlaka oluqinile oluqinile olwenziwe yi-cast metal molding luhlanganisa i-Y axis frame.Inezici ezinhle kakhulu zokulwa nokudlidliza ezisekela ukusebenza kwesivinini esikhulu

Isistimu yokushayela ye-XY ihlanganisa “Ukulawulwa okugcwele kweluphu okuvaliwe” kwe-JUKI kusetshenziswa izinjini ze-AC nezishumeki zomugqa kazibuthe.I-Dual motor drive yakho kokubili i-X ne-Y ifinyelela isivinini esikhulu, nokubeka okuthembeke kakhulu okungathintwa uthuli nokuhlukahluka kwezinga lokushisa.Izinjini ezizimele Z kanye no-u zithuthukisa ukunemba nokuqina

3 Ubuchwepheshe be-Vision centering

Indlela yokubeka indawo ingakhethwa ngokusekelwe kuhlobo lwengxenye, umumo, usayizi nezinto ezibonakalayo.I-Laser centering isetshenziselwa ukubeka isivinini esikhulu sezingxenye ezincane.Umbono usetshenziswa lapho kuhlolwa umthofu noma ibhola noma lapho ingxenye inkulu kakhulu ku-laser.Ama-nozzles amaningi ayatholakala ezingxenyeni ezimise okungavamile ezihlinzeka ngokubamba ingxenye engenakuqhathaniswa.

(2) MNVC (Multi-Nozzle Vision Centering)

Ukubeka maphakathi nendawo ngekhanda le-nozzle eminingi kucishe kuphinde kabili izinga lokubeka lezingxenye ezincane, okufaka phakathi ama-CSP, ama-BGA, nama-QFP amancane.(Inketho) I-MNVC iyatholakala naku-KE-2070.

4 Izici ezithuthukile zezinhlelo zokusebenza ezithuthukayo nezihlukene

(1) FCS (Flex Calibration System

Ukulungiswa okulula kwe-JUKI okubhekwa njengokulula sekulula nakakhulu!Ijigi yokulinganisa ye-FCS yokuzikhethela ilula ukusebenzisa isistimu ukulinganisa kabusha ukunemba kokubekwa.Umshini ukhetha ngokuzenzakalelayo futhi ubeke izingxenye zejig, bese ukala iphutha futhi ulungise konke ukulinganisa okudingekayo.(uyazikhethela)

(2) Ukuqashelwa okuyimfihlo

Uhlelo lokukhanyisa lwe-OCC lusekela inhlobonhlobo yezinto zebhodi ezihlanganisa i-FPC (Flexible Printed Circuit board) Ukukhanya okuhlelekayo nokukhanyisa okuqondisayo kuthuthukisa ukuqashelwa kwe-fiducial.