* 1 Izimo zokucaciswa (Ingxenye esebenzayo: I-Aluminium electrolytic capacitor (φ 8 mm), Isiphakeli: i-MRF-S emibili, Izimo zokubeka: Ukukhetha ngesikhathi esisodwa, ukufakwa okulandelanayo kusetshenziswa imibhobho engu-2)
* Izimo ezi-2 zokucaciswa (Ingxenye esebenzayo: Isixhumi (izikhonkwane ezi-4), Izimo zokufaka: ukukhetha oku-2 okulandelanayo nokufakwa kusetshenziswa imibhobho emi-2)
* 3 Ukudluliswa kwebhodi kanye nesikhathi sokuqashelwa uphawu asifakiwe.
* 4 Uma ingxenye ukuphakama 16 mm.
Ukucaciswa okujwayelekile (Lsize PWB) | Ukucaciswa kwe-clinch (Lsize PWB) | |||
Ngokusebenzisa iyunithi ye-Clinch | Ngaphandle kokusebenzisa iyunithi ye-Clinch | |||
Usayizi Webhodi | 1 isikhathi sokubamba | 50㎜×50㎜~410㎜×360㎜ | 80㎜×100㎜~410㎜×360㎜ | 80㎜×50㎜~410㎜×360㎜ |
2 izikhathi clamping | 50㎜×50㎜~800㎜×360㎜ | 80㎜×100㎜~800㎜×360㎜ | 80㎜×100㎜~800㎜×360㎜ | |
PCB Isisindo | ubuningi obungu-4kg | |||
Ukuphakama Kwengxenye | ubuningi.30㎜ | |||
Usayizi Wengxenye | Ukuqashelwa kwe-laser | 0603 ~ □ 50mm | ||
Ukuqashelwa kombono | □3mm~●50mm | |||
Isivinini Sokufaka (Izingxenye zokufaka) | Vacuum | 0.6 isekhondi/ingxenye*1*3*4 | ||
bamba | 0.8 isekhondi/ingxenye*2*3*4 | |||
Ukunemba Kokubekwa (SMT) | Ukuqashelwa kwe-laser | ±0.05mm (3s) | ||
Ukuqashelwa kombono | ±0.04mm |